TPCI and IPMMI organise IndusFood Pac-Tech Roadshow
Trade Promotion Council of India organized the Roadshow for Indusfood Pac-Tech for Smart Packaging Systems in association with IPMMI on December 22, 2021 at New Delhi. The platform was set up to facilitate better understanding of Indus Food Tech among food packaging technology companies and also showcase the latest smart packaging technology.
Trade Promotion Council of India organized the Indusfood Pac-Tech Roadshow for Smart Packaging Systems in association with IPMMI on December 22, 2021 at New Delhi. The roadshow aimed to disseminate information with food packaging technology companies and potential buyers of packaging technology on Indusfood Tech/Indusfood Pac-Tech 2022 and also to showcase latest smart packaging systems that will make India as a smart packaging destination in the future.
Ashok Sethi, Director, TPCI, Rajiv Agarwal, Managing Director, Scan Holdings (P) Limited, Anik Roy, Deputy Director, TPCI and Ambrish Bhargava, Committee Member IPMMI and Chairman, XPRT Engineered Packaging Solutions Pvt. Ltd. were Chief Guests at the function.
The participants at the roadshow included over 70 companies (providers and users) from the packaging technology industry.